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'Eco-Patent Commons' hopes to improve environmental innovation
Key Excerpts from Article on Website of San Francisco Chronicle (San Francisco's leading newspaper)
Posted: January 20th, 2008
http://www.sfgate.com/cgi-bin/article.cgi?f=/c/a/2008/01/14/...
IBM Corp., Nokia, Sony and Pitney Bowes are expected to announce Monday that they have put 31 inventions into an "Eco-Patent Commons" designed to make these Earth-friendly manufacturing and waste-reduction processes more widely available. "This is an open source effort along the lines of the Creative Commons," said IBM assistant general counsel David Kappos, who is responsible for the company's intellectual property. The open source movement, symbolized by the free Linux operating system, believes that innovation occurs more quickly when new ideas and processes are open to the public for anyone to troubleshoot and improve. The Eco-Patent Commons adopts this activist tactic in certain fields - like waste reduction - where the participating firms have decided that the societal benefit of having every willing manufacturer adopt these cleaner processes outweighs any potential advantage they might gain by keeping the idea close to the vest. One of the newly freed eco-patents is an IBM invention for using a specially folded piece of corrugated cardboard to cushion electronic components against shock during shipping - replacing the Styrofoam products that can easily become an environmental headache. Likewise, Nokia is giving away a patent designed to help safely dispose of mobile phones by reusing their components in other gadgets such as digital cameras. Kappos said the Eco-Patent Commons would be run by an independent, nonprofit group, the World Business Council for Sustainable Development, and expressed hope that other companies would follow the lead and add real clout to what is more a symbolic than substantive effort to make global business a little greener.
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